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TZM Molybdenum Alloy Plate Targer For Semiconductor
1. Description of TZM Molybdenum Alloy Plate Targer For Semiconductor:
The surface of TZM molybdenum alloy plate target is silver gray with metallic luster, which is widely used in mold and parts furnace construction, component manufacturing in electronic and semiconductor industries. Vacuum furnace and high temperature furnace and plate electrodes of thermal insulation materials and other industries.
Thickness 5~80mm
Width 200~610mm
Length 150~1500mm
Also we can process as per customer's drawing.
2. Advantages compared to pure molybdenum of TZM Molybdenum Alloy Plate Targer For Semiconductor:
Better creep resistance,
Higher recrystallization temperature,
Better high temperature strength,
Good welding performance.
3. Actual measured chemical composition of TZM Molybdenum Alloy Plate Targer :
Element | Si | Mn | Ni | Cu | V | Zr | O | P | Fe | Mg |
Concentration(%) | 0.002 | 0.0009 | 0.0008 | 0.0018 | 0.013 | 0.086 | 0.32 | 0.001 | 0.0011 | 0.0015 |
Element | Al | Ti | Ca | C | N | |||||
Concentration(%) | 0.001 | 0.5 | <0.001 | 0.012 | 0.0022 | |||||
Purity(Metallic Base) Mo≥99.06%(TZM) |
4. Production Craft of TZM Molybdenum Alloy Plate Targer For Semiconductor:
The billet is then subjected to high temperature hot rolling (high temperature forging), high temperature annealing, medium temperature hot rolling (medium temperature forging), medium temperature annealing to eliminate stress, and then warm rolling (warm forging) to obtain TZM alloy (molybdenum zirconium titanium alloy) finished material.
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